3D NAND Memory Market Global Market - Overview
The 3D NAND memory widely used in the consumer electronics such as smartphone, laptop and mobile and many among them. This 3D NAND memory is arranged vertical form in multi –level layers which offers to improve the performance of the devices with low latency time compared to the conventional storage devices such as tape and hard disk drives. On the flip side, 2D (planar) NAND memory had limited storage capacity which eventually decreases the dependency on the planar memory cells. Thus, in order to increase the storage capacity at lower cost, the 3D NAND has been developed to counter the difficulties faced by planar NAND memory. On the basis of storing capacity, the 3D NAND are of three types, single-level cell, multiple level cell and triple-level cell. Mostly multiple-level and triple-level cell are widely used due to advanced reliability and high endurance quality of the NAND memory. However, the increase in demand for improved data storage devices and cost –efficient solution are anticipated to drive the market over the forecast period. On the flip side, the high cost for the manufacturing of 3D NAND memory is expected to hinder growth of the market over the review period.
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Market Segmentation
- Segmentation by Type: Single-level cell (SLC), Multi-level cell (MLC) and Triple-level cell (TLC).
- Segmentation by Application: Consumer Electronics, Mass Storage, Industrial, Aerospace & Defence, Telecommunication among others.
Study Objective of 3D NAND Memory Market
- To provide detailed analysis of the market structure along with forecast of the various segments and sub-segments of the Global 3D NAND Memory Market Share
- To provide insights about factors affecting the market growth
- To analyze the 3D NAND Memory market based on various factors- price analysis, supply chain analysis, porter’s five force analysis etc.
- To provide historical and forecast revenue of the market segments and sub-segments with respect to four main geographies and their countries- North America, Europe, Asia, and Rest of the World (ROW)
- To provide country level analysis of the market with respect to the current market size and future prospective
- To provide country level analysis of the market for segment by technology, by type and sub-segments.
- To provide strategic profiling of key players in the market, comprehensively analyzing their core competencies, and drawing a competitive landscape for the market
- To track and analyze competitive developments such as joint ventures, strategic alliances, mergers and acquisitions, new product developments, and research and developments in the Global 3D NAND Memory Market.
Global 3D NAND Memory Market - Regional Analysis
The Asia Pacific region dominates the global 3D NAND memory market. The largest market share attributes to the increasing demand for highly durable and lightweight memory chips in enterprise storage and automotive applications. Besides, a large number of semiconductor manufacturing facilities in the region encourage the early adoption of 3D NAND memory.
Moreover, rising technological advances and the adoption of high speed and low power consuming memory devices in various industry verticals drive the regional market growth. Rapid economic growth and spurted industrialization in the region are other major factors boosting the market growth. The APAC flash memory market is estimated to retain its dominance throughout the projected period.
North America stands second in the 3D NAND memory market. The market increase is driven by vast advances in storage technologies and the presence of many notable players. Additionally, well-established end-user verticals in the region create substantial market demand. Broad uptake of flash memory devices fosters opportunities in the regional market.
Furthermore, increasing investments transpired in technology developments propel the market share of the region. Simultaneously, the demand for reliable backup and recovery systems support market growth in the region. The North American 3d NAND industry is expected to witness rapid growth during the assessment period.
Europe 3D NAND memory market is emerging as the fastest-growing market. Factors such as the growing number of businesses and technology upgrades boost the growth of the flash memory market. Moreover, increasing economic growth is a significant tailwind behind the growth of the 3d NAND industry in the region.
Germany, France, Italy, and the UK, contribute to regional market growth. The European flash memory market is estimated to create a substantial revenue pocket in the next six years.
Global 3D NAND Memory Market - Competitive Analysis
Highly competitive, the 3D NAND memory market appears and fragmented due to the presence of several well-established players. To gain a larger competitive share in the market, industry players adopt strategic moves such as mergers & acquisitions, collaboration, expansion, and product/ technology launch.
Major Players:
Players leading the global 3D NAND memory market include Toshiba Corporation (Japan), SAMSUNG (South Korea), Western Digital Corporation (US), Panasonic Corporation (Japan), Intel Corporation (US), Cypress Semiconductor Corporation (US), Hitachi High-Technologies Corporation (Japan), Micron Technology, Inc. (US), SK HYNIX INC. (South Korea), Transcend Information, Inc. (US), Macronix International Co., Ltd (Taiwan), Applied Materials, Inc. (US), Yangtze Memory Technologies Co., Ltd (YMTC, China), and Delkin Devices (US), among others.
Industry/Innovation/ Related News:
December 04, 2020 --- TDK Corporation (Japan), a world leader in electronic solutions, launched a new generation of flash storage devices with five series optimized for industrial, medical, art grid, transportation, and security applications. All five highly reliable SSDs with 3D NAND flash memory use TDK’s proprietary NAND flash memory control IC - GBDriver GS2, supporting serial ATA.
With advancements in 3D flash memory technology, flash storage solutions with over 1 TB are more widely used capacities, but data reliability requirements continue to become more sophisticated. Equipped with 3D NAND (TLC/ pSLC), flash storage is integrated into edge devices in industrial equipment and IIoT devices that are mostly used to store OS or device applications. The demand has increased for highly reliable storage devices to protect user data.
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3D NAND Memory Market Research Report: Information By Type [Multi-Level Cell (MLC), Triple-Level Cell (TLC), Quad-Level Cell (QLC)], Application (USB, Flash Card, SSD, Smartphone, Tablet, Kiosk, and Others), Vertical (Aerospace & Defense, IT & Telecommunication, Healthcare, Transportation, Retail, and Others), and Region (North America, Europe, Asia-Pacific, Middle East & Africa, and Central & South America)-Forecast till 2027
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